Ding-Ming Kwai: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

Про збір коштів Детальніше

Підтримати

Книги
Статті (97)
Найпопулярніші
Перелік
- Перелік
- Таблиця

FFT computation with linear processor arrays using a data-driven control scheme

Ding-Ming Kwai, Behrooz Parhami

Журнал:

Journal of Signal Processing Systems

Рік:

1996

Мова:

english

Файл:

PDF, 856 KB

english, 1996

[IEEE 2005 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'05) - Taipei, Taiwan (03-05 Aug. 2005)] 2005 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'05) - Measurement and Characterization of 6T SRAM Cell Current

Ching-Hua Hsiao,, Ding-Ming Kwai,

Рік:

2005

Мова:

english

Файл:

PDF, 958 KB

english, 2005

Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis

Yu-Hsiang Lin,, Shi-Yu Huang,, Kun-Han Tsai,, Wu-Tung Cheng,, Sunter, S., Yung-Fa Chou,, Ding-Ming Kwai,

Журнал:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Рік:

2013

Мова:

english

Файл:

PDF, 1.21 MB

english, 2013

[IEEE 2006 IEEE Asian Solid-State Circuits Conference - Hangzhou, China (2006.11.13-2006.11.15)] 2006 IEEE Asian Solid-State Circuits Conference - Standby Current Reduction of Compilable SRAM Using Sleep Transistor and Source Line Self Bias

Kwai, Ding-Ming

Рік:

2006

Мова:

english

Файл:

PDF, 4.62 MB

english, 2006

[IEEE 2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06) - Taipei, Taiwan (02-04 Aug. 2006)] 2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06) - SRAM Cell Current in Low Leakage Design

Ding-Ming Kwai,, Ching-Hua Hsiao,, Chung-Ping Kuo,, Chi-Hsien Chuang,, Min-Chung Hsu,, Yi-Chun Chen,, Yu-Ling Sung,, Hsien-Yu Pan,, Chia-Hsin Lee,, Meng-Fan Chang,, Yung-Fa Chou,

Рік:

2006

Мова:

english

Файл:

PDF, 506 KB

english, 2006

[IEEE Comput. Soc 5th International Symposium on Quality Electronic Design - San Jose, CA, USA (22-24 March 2004)] SCS 2003. International Symposium on Signals, Circuits and Systems. Proceedings (Cat. No.03EX720) - Supply and substrate noise tolerance using dynamic tracking clusters in configurable memory designs

Meng-Fan Chang,, Kuei-Ann Wen,, Ding-Ming Kwai,

Рік:

2004

Мова:

english

Файл:

PDF, 248 KB

english, 2004

[ACM Press the 49th Annual Design Automation Conference - San Francisco, California (2012.06.03-2012.06.07)] Proceedings of the 49th Annual Design Automation Conference on - DAC '12 - Small delay testing for TSVs in 3-D ICs

Huang, Shi-Yu, Lin, Yu-Hsiang, Tsai, Kun-Han (Hans), Cheng, Wu-Tung, Sunter, Stephen, Chou, Yung-Fa, Kwai, Ding-Ming

Рік:

2012

Мова:

english

Файл:

PDF, 1021 KB

english, 2012

[IEEE 2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC) - Chiba, Japan (2017.1.16-2017.1.19)] 2017 22nd Asia and South Pacific Design Automation Conference (ASP-DAC) - Heterogeneous chip power delivery modeling and co-synthesis for practical 3DIC realization

Liao, Wei-Hsun, Lin, Chang-Tzu, Fang, Sheng-Hsin, Huang, Chien-Chia, Chen, Hung-Ming, Kwai, Ding-Ming, Chou, Yung-Fa

Рік:

2017

Мова:

english

Файл:

PDF, 956 KB

english, 2017

[IEEE 2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI) - Bochum, Germany (2017.7.3-2017.7.5)] 2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI) - On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC

Fang, Sheng-Hsin, Lin, Chang-Tzu, Liao, Wei-Hsun, Huang, Chien-Chia, Chen, Li-Chin, Chen, Hung-Ming, Lee, I-Hsuan, Kwai, Ding-Ming, Chou, Yung-Fa

Рік:

2017

Мова:

english

Файл:

PDF, 590 KB

english, 2017

Multi-dimensional parallel computing structures for regular iterative algorithms

Chein-Wei Jen, Ding-Ming Kwai

Журнал:

Integration, the VLSI Journal

Рік:

1989

Мова:

english

Файл:

PDF, 438 KB

english, 1989

Comparing four classes of torus-based parallel architectures: Networkparameters and communication performance

B. Parhami, Ding-Ming Kwai

Журнал:

Mathematical and Computer Modelling

Рік:

2004

Мова:

english

Файл:

PDF, 1.25 MB

english, 2004

Pruned three-dimensional toroidal networks

Ding-Ming Kwai, Behrooz Parhami

Журнал:

Information Processing Letters

Рік:

1998

Мова:

english

Файл:

PDF, 388 KB

english, 1998

Incomplete k-ary n-cube and its derivatives

Behrooz Parhami, Ding-Ming Kwai

Журнал:

Journal of Parallel and Distributed Computing

Рік:

2004

Мова:

english

Файл:

PDF, 291 KB

english, 2004

An on-line fault diagnosis scheme for linear processor arrays

Ding-Ming Kwai, Behrooz Parhami

Журнал:

Microprocessors and Microsystems

Рік:

1997

Мова:

english

Файл:

PDF, 703 KB

english, 1997

Scalability of Programmable FIR Digital Filters

Ding-Ming Kwai, Behrooz Parhami

Журнал:

Journal of Signal Processing Systems

Рік:

1999

Мова:

english

Файл:

PDF, 87 KB

english, 1999

Scalable Linear Array Architecture with Data-Driven Control for Ultrahigh-Speed Vector Quantization

Ding-Ming Kwai, Behrooz Parhami

Журнал:

Journal of Signal Processing Systems

Рік:

2001

Мова:

english

Файл:

PDF, 298 KB

english, 2001

Area-time tradeoffs in FIR digital filters with broadcast and pipelined designs

Ding-Ming Kwai, Behrooz Parhami

Журнал:

Computer Standards & Interfaces

Рік:

1999

Мова:

english

Файл:

PDF, 69 KB

english, 1999

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Floorplanning 1024 cores in a 3D-stacked networkon- chip with thermal-aware redistribution

Chien, Jui-Hung, Lung, Chiao-Ling, Hsu, Chin-Chi, Chou, Yung-Fa, Kwai, Ding-Ming

Рік:

2010

Мова:

english

Файл:

PDF, 4.00 MB

english, 2010

Die-to-Die Clock Synchronization for 3-D IC Using Dual Locking Mechanism

Ke, Ji-Wei, Huang, Shi-Yu, Tzeng, Chao-Wen, Kwai, Ding-Ming, Chou, Yung-Fa

Журнал:

IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications

Рік:

2013

Мова:

english

Файл:

PDF, 2.55 MB

english, 2013

Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias

Yung-Fa Chou, Ding-Ming Kwai, Cheng-Wen Wu

Журнал:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Рік:

2011

Мова:

english

Файл:

PDF, 1.37 MB

english, 2011

An MCT-Based Bit-Weight Extraction Technique for Embedded SAR ADC Testing and Calibration

Xuan-Lun Huang, Jiun-Lang Huang, Hung-I Chen, Chang-Yu Chen, Tseng Kuo-Tsai, Ming-Feng Huang, Yung-Fa Chou, Ding-Ming Kwai

Журнал:

Journal of Electronic Testing

Рік:

2012

Мова:

english

Файл:

PDF, 1.03 MB

english, 2012

Data flow representation of iterative algorithms for systolic arrays

Chein-Wei Jen, Ding-Ming Kwai

Журнал:

IEEE Transactions on Computers

Рік:

1992

Мова:

english

Файл:

PDF, 429 KB

english, 1992

Application-Independent Testing of 3-D Field Programmable Gate Array Interconnect Faults

Peng, Yen-Lin, Kwai, Ding-Ming, Chou, Yung-Fa, Wu, Cheng-Wen

Журнал:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Рік:

2014

Мова:

english

Файл:

PDF, 1.46 MB

english, 2014

Reactivation of Spares for Off-Chip Memory Repair After Die Stacking in a 3-D IC With TSVs

Chou, Yung-Fa, Kwai, Ding-Ming, Shieh, Ming-Der, Wu, Cheng-Wen

Журнал:

IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications

Рік:

2013

Мова:

english

Файл:

PDF, 1.79 MB

english, 2013

In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis

You, Jhih-Wei, Huang, Shi-Yu, Lin, Yu-Hsiang, Tsai, Meng-Hsiu, Kwai, Ding-Ming, Chou, Yung-Fa, Wu, Cheng-Wen

Журнал:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Рік:

2013

Мова:

english

Файл:

PDF, 3.22 MB

english, 2013

[IEEE 2013 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu (2013.4.22-2013.4.24)] 2013 International Symposium onVLSI Design, Automation, and Test (VLSI-DAT) - Enabling inter-die co-optimization in 3-D IC with TSVs

Chang-Tzu Lin,, Tsu-Wei Tseng,, Yung-Fa Chou,, Chia-Hsin Lee,, Ding-Ming Kwai,

Рік:

2013

Мова:

english

Файл:

PDF, 777 KB

english, 2013

Practical considerations in applying Î£-Î modulation-based analog BIST to sampled-data systems

Hao-Chiao Hong,, Jiun-Lang Huang,, Kwang-Ting Cheng,, Cheng-Wen Wu,, Ding-Ming Kwai

Журнал:

IEEE Transactions on Circuits and Systems II Analog and Digital Signal Processing

Рік:

2003

Мова:

english

Файл:

PDF, 1.08 MB

english, 2003

[IEEE 2013 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu (2013.4.22-2013.4.24)] 2013 International Symposium onVLSI Design, Automation, and Test (VLSI-DAT) - Worst-case IR-drop monitoring with 1GHz sampling rate

Chen-Hsiang Hsu,, Shi-Yu Huang,, Ding-Ming Kwai,, Yung-Fa Chou,

Рік:

2013

Мова:

english

Файл:

PDF, 630 KB

english, 2013

[IEEE 2011 IEEE VLSI Test Symposium (VTS) - Dana Point, CA, USA (2011.05.1-2011.05.5)] 29th VLSI Test Symposium - A built-in self-test scheme for the post-bond test of TSVs in 3D ICs

Huang, Yu-Jen, Li, Jin-Fu, Chen, Ji-Jan, Kwai, Ding-Ming, Chou, Yung-Fa, Wu, Cheng-Wen

Рік:

2011

Мова:

english

Файл:

PDF, 1.47 MB

english, 2011

[IEEE 2012 18th International Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW 2012) - Taipei, Taiwan (2012.05.14-2012.05.16)] 2012 IEEE 18th International Mixed-Signal, Sensors, and Systems Test Workshop - Testing and Calibration of SAR ADCs by MCT-Based Bit Weight Extraction

Huang, Xuan-Lun, Chen, Hung-I, Huang, Jiun-Lang, Chen, Chang-Yu, Kuo-Tsai, Tseng, Huang, Ming-Feng, Chou, Yung-Fa, Kwai, Ding-Ming

Рік:

2012

Мова:

english

Файл:

PDF, 228 KB

english, 2012

[IEEE 2011 IEEE 17th International Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW 2011) - Santa Barbara, CA, USA (2011.05.16-2011.05.18)] 2011 IEEE 17th International Mixed-Signals, Sensors and Systems Test Workshop - On Pre/Post-Bond Testing and Calibrating SAR ADC Array in 3-D CMOS Imager

Huang, Xuan-Lun, Kang, Ping-Ying, Huang, Jiun-Lang, Chou, Yung-Fa, Lee, Yung-Pin, Kwai, Ding-Ming

Рік:

2011

Мова:

english

Файл:

PDF, 287 KB

english, 2011

[IEEE 2011 International Symposium on Quality Electronic Design (ISQED) - Santa Clara, CA, USA (2011.03.14-2011.03.16)] 2011 12th International Symposium on Quality Electronic Design - 3D Stacked IC layout considering bond pad density and doubling for manufacturing yield improvement

Kwai, Ding-Ming, Lin, Chang-Tzu

Рік:

2011

Файл:

PDF, 371 KB

2011

[IEEE 2010 IEEE International Conference of Electron Devices and Solid- State Circuits (EDSSC) - Hong Kong (2010.12.15-2010.12.17)] 2010 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC) - A high-resolution all-digital duty-cycle corrector with a new pulse-width detector

Ji-Wei Ke,, Shi-Yu Huang,, Ding-Ming Kwai,

Рік:

2010

Мова:

english

Файл:

PDF, 1.46 MB

english, 2010

Addressable failure site test structures (AFS-TS) for CMOS processes: Design guidelines, fault simulation, and implementation

Doong, K.Y.-Y., Sunnys Hsieh,, Sheng-Che Lin,, Binson Shen,, Jye-Yen Cheng,, Ding-Ming Kwai,, Hess, C., Weiland, L.H., Hsu, C.C.H.

Журнал:

IEEE Transactions on Semiconductor Manufacturing

Рік:

2001

Мова:

english

Файл:

PDF, 1.22 MB

english, 2001

[IEEE 2011 16th Asia and South Pacific Design Automation Conference, ASP-DAC 2011 - Yokohama (2011.1.25-2011.1.28)] 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011) - A self-testing and calibration method for embedded successive approximation register ADC

Xuan-Lun Huang,, Ping-Ying Kang,, Hsiu-Ming Chang,, Jiun-Lang Huang,, Yung-Fa Chou,, Yung-Pin Lee,, Ding-Ming Kwai,, Cheng-Wen Wu,

Рік:

2011

Мова:

english

Файл:

PDF, 182 KB

english, 2011

[IEEE 1996 IEEE Second International Conference on Algorithms and Architectures for Parallel Processing, ICA/sup 3/PP '96 - Singapore (11-13 June 1996)] Proceedings of 1996 IEEE Second International Conference on Algorithms and Architectures for Parallel Processing, ICA/sup 3/PP '96 - Fault-tolerant processor arrays using space and time redundancy

Ding-Ming Kwai,, Parhami, B.

Рік:

1996

Мова:

english

Файл:

PDF, 717 KB

english, 1996

[IEEE 2009 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT) - Hsinchu, Taiwan (2009.08.31-2009.09.2)] 2009 IEEE International Workshop on Memory Technology, Design, and Testing - Memory Repair by Die Stacking with through Silicon Vias

Chou, Yung-Fa, Kwai, Ding-Ming, Wu, Cheng-Wen

Рік:

2009

Мова:

english

Файл:

PDF, 460 KB

english, 2009

[IEEE 2009 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT) - Hsinchu, Taiwan (2009.08.31-2009.09.2)] 2009 IEEE International Workshop on Memory Technology, Design, and Testing - Modeling of SRAM Standby Current by Three-Parameter Lognormal Distribution

Kwai, Ding-Ming

Рік:

2009

Мова:

english

Файл:

PDF, 404 KB

english, 2009

[IEEE 2010 IEEE Asian Solid-State Circuits Conference (A-SSCC) - Beijing (2010.11.8-2010.11.10)] 2010 IEEE Asian Solid-State Circuits Conference - Is 3D integration the way out of the crossroads?

Ding-Ming Kwai,, Yung-Fa Chou,, Cheng-Wen Wu,

Рік:

2010

Мова:

english

Файл:

PDF, 1.75 MB

english, 2010

[IEEE 2009 Asian Test Symposium - Taichung, Taiwan (2009.11.23-2009.11.26)] 2009 Asian Test Symposium - On-Chip TSV Testing for 3D IC before Bonding Using Sense Amplification

Chen, Po-Yuan, Wu, Cheng-Wen, Kwai, Ding-Ming

Рік:

2009

Мова:

english

Файл:

PDF, 552 KB

english, 2009

[IEEE 2013 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu (2013.4.22-2013.4.24)] 2013 International Symposium onVLSI Design, Automation, and Test (VLSI-DAT) - An FPGA-based test platform for analyzing data retention time distribution of DRAMs

Chih-Sheng Hou,, Jin-Fu Li,, Chih-Yen Lo,, Ding-Ming Kwai,, Yung-Fa Chou,, Cheng-Wen Wu,

Рік:

2013

Мова:

english

Файл:

PDF, 540 KB

english, 2013

Data-driven control scheme for linear arrays: application to a stable insertion sorter

Parhami, B., Ding-Ming Kwai,

Журнал:

IEEE Transactions on Parallel and Distributed Systems

Рік:

1999

Мова:

english

Файл:

PDF, 597 KB

english, 1999

[IEEE Comput. Soc Ninth Asian Test Symposium - Taipei, Taiwan (4-6 Dec. 2000)] Proceedings of the Ninth Asian Test Symposium - Detection of SRAM cell stability by lowering array supply voltage

Ding-Ming Kwai,, Hung-Wen Chang,, Hung-Jen Liao,, Ching-Hua Chiao,, Yung-Fa Chou,

Рік:

2000

Мова:

english

Файл:

PDF, 454 KB

english, 2000

[IEEE 2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06) - Taipei, Taiwan (02-04 Aug. 2006)] 2006 IEEE International Workshop on Memory Technology, Design, and Testing (MTDT'06) - FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment

Ding-Ming Kwai,, Yung-Fa Chou,, Meng-Fan Chang,, Su-Meng Yang,, Ding-Sheng Chen,, Min-Chung Hsu,, Yu-Zhen Liao,, Shiao-Yi Lin,, Yu-Ling Sung,, Chia-Hsin Lee,, Hsin-Kun Hsu,

Рік:

2006

Мова:

english

Файл:

PDF, 425 KB

english, 2006

[IEEE 2012 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu (2012.04.23-2012.04.25)] Proceedings of Technical Program of 2012 VLSI Design, Automation and Test - 3-D centric technology and realization with TSV

Chang-Tzu Lin,, Chia-Hsin Lee,, Tsu-Wei Tseng,, Ding-Ming Kwai,, Yung-Fa Chou,

Рік:

2012

Мова:

english

Файл:

PDF, 538 KB

english, 2012

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Design and implementation of 3D-thermal test chip for exploration of package effects

Chien, Jui-Hung, Lung, Chiao-Ling, Lin, Ta-Wei, Tsai, Kun-Ju, Chen, Ting-Sheng, Chou, Yung-Fa, Chen, Ping-Hei, Chang, Shih-Chieh, Kwai, Ding-Ming

Рік:

2011

Мова:

english

Файл:

PDF, 9.16 MB

english, 2011

Low-Cost Error Tolerance Scheme for 3-D CMOS Imagers

Chang, Hsiu-Ming Chang, Huang, Jiun-Lang, Kwai, Ding-Ming, Cheng, Kwang-Ting, Wu, Cheng-Wen

Журнал:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Рік:

2013

Мова:

english

Файл:

PDF, 1.18 MB

english, 2013

[IEEE 2013 IEEE 31st VLSI Test Symposium (VTS) - Berkeley, CA (2013.4.29-2013.5.2)] 2013 IEEE 31st VLSI Test Symposium (VTS) - Special session 4C: Hot topic 3D-IC design and test

Li, Jin-Fu, Wu, Cheng-Wen, Wu, Cheng-Wen, Aoyagi, Masahiro, Marvin Chang, Meng-Fan, Kwai, Ding-Ming

Рік:

2013

Мова:

english

Файл:

PDF, 101 KB

english, 2013

[IEEE 2012 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - Hsinchu (2012.04.23-2012.04.25)] Proceedings of Technical Program of 2012 VLSI Design, Automation and Test - 3D-IC BISR for stacked memories using cross-die spares

Chun-Chuan Chi,, Yung-Fa Chou,, Ding-Ming Kwai,, Yu-Ying Hsiao,, Cheng-Wen Wu,, Yu-Tsao Hsing,, Li-Ming Denq,, Tsung-Hsiang Lin,

Рік:

2012

Мова:

english

Файл:

PDF, 432 KB

english, 2012

Correction to "Periodically regular chordal rings"

Parhami, B., Ding-Ming Kwai,

Журнал:

IEEE Transactions on Parallel and Distributed Systems

Рік:

1999

Мова:

english

Файл:

PDF, 68 KB

english, 1999